Micro-electronics Technician - 2nd Shift

Anduril Industries is a defense technology company with a mission to transform U.S. and allied military capabilities with advanced technology. By bringing the expertise, technology, and business model of the 21st century’s most innovative companies to the defense industry, Anduril is changing how military systems are designed, built and sold. Anduril’s family of systems is powered by Lattice OS, an AI-powered operating system that turns thousands of data streams into a realtime, 3D command and control center. As the world enters an era of strategic competition, Anduril is committed to bringing cutting-edge autonomy, AI, computer vision, sensor fusion, and networking technology to the military in months, not years. About the Role Join Anduril Industries' AIRS team, a leader in the design and manufacture of high-performance cooled infrared cameras and components. As a Micro-electronics Technician, you will play a crucial role in the production of these cutting-edge electronic components, directly contributing to the expansion of Anduril's advanced sensing systems. We are seeking a meticulous and skilled individual with demonstrated expertise in wire bonding and microelectronic assembly processes. The ideal candidate will ensure that our products consistently meet the highest standards of quality, performance, and reliability. Note: This role is dedicated to second shift. Approximate work hours are 3-4PM start time to 11 PM to Midnight end time. WHAT YOU'LL DO: Execute Complex Wire Bonding Operations: Operate and maintain a variety of wire bonding equipment, including manual, semi-automatic, and automated bonders (e.g., Westbond), to perform precise gold ball, wedge, ribbon, alloy, and manganin wire bonding (e.g., 0.001" diameter) onto various substrates such as duroid and ceramic, capacitors, resistors, diodes, and spirals. Perform Microelectronic Assembly: Conduct intricate assembly tasks, including the careful mixing and application of various adhesives, glues, and epoxies, and the integration of micro-electronic components such as temperature diodes, capacitors, and alumina materials. Interpret Technical Documentation: Accurately read and interpret detailed build sheets, Interface Control Documents (ICDs), and engineering drawings, ensuring meticulous adherence to complex specifications and process requirements. Equipment Setup and Optimization: Independently perform setup, calibration, and make minor adjustments to wire bonding machinery, optimizing parameters such as loop heights to achieve superior bond quality and throughput. Quality Assurance and Inspection: Conduct rigorous in-process and final inspections, utilizing measurement equipment (e.g., reticle, indicator, microscope, bond puller) to verify bond quality and ensure full compliance with design specifications and quality standards. Troubleshooting and Collaboration: Work effectively with technicians, engineers, and other technical personnel to identify, analyze, and resolve technical problems encountered during production, contributing to process improvements and parameter optimization. Maintain Production Standards: Consistently meet high standards for quality, consistency, and work rate while strictly adhering to all cleanroom protocols, safety guidelines, and ESD procedures to maintain a safe and efficient work environment. REQUIRED QUALIFICATIONS: High School Diploma or equivalent. Candidates should possess hands-on experience in wire bonding or microelectronic manufacturing OR demonstrate equivalent practical skills gained from a technical bootcamp or certification program in a related field. Proven proficiency in various wire bonding techniques (manual gold ball, wedge, ribbon; semi-automatic; automated) and intricate microelectronic assembly, including precise adhesive and epoxy application. Exceptional manual dexterity and the ability to work consistently and accurately under a microscope for an entire shift. Strong ability to read, interpret, and follow d