PCB Designer

Northwood is on a mission to transform connectivity between Earth and space. Satellites are only as powerful as the ground systems that connect to them - without that critical infrastructure, they can’t be steered or send their data back to Earth. Northwood’s global ground network ensures that missions ranging from national security, to global connectivity, to disaster response can unlock their full potential and operate every day without fail. We take a vertically integrated approach to building an end-to-end ground system, delivering technology that is scalable and reliable for both government and commercial customers. Backed by over $100M from investors like Andreessen Horowitz, Washington Harbour Partners, Alpine Space Ventures, Founders Fund, and others, Northwood has proven its ability to move fast – we’ve stood up a fully operational site in Australia in just 3 months, where similar efforts typically take years. Northwood is rapidly scaling its global footprint, with 30+ sites planned across 2026 and 2027. We’re building and deploying infrastructure at a pace the industry hasn’t seen before. If you thrive on building quickly, solving hard problems, and seeing your work deployed globally on critical missions, we want you at Northwood. PCB DESIGNER (HIGH SPEED, MIXED SIGNAL ELECTRONICS) Northwood is looking for a PCB Designer to help drive the physical layout and development of our next-generation digital compute and power electronics. These complex boards ensure that our antennas can meet high-rate processing needs no matter where they are deployed around the world. As a PCB Designer at Northwood, you won’t just be routing traces; you will partner closely with our Electrical, RF, and Antenna engineers from concept to production, providing layout expertise to deliver hardware known for its reliability, scalability, and cost. RESPONSIBILITIES - Own the physical layout of complex, high-density, and high-layer-count PCBs featuring high-speed digital, RF, mixed-signal, and power distribution systems. - Determine optimum layer stackups, perform component placement, routing feasibility studies, and manage strict high-speed constraint rules. - Perform ECAD library creation, management, and maintenance for a wide array of active, passive, and high-pin-count components. - Collaborate across hardware and production teams to ensure strict adherence to Design for Manufacturability (DFM), Design for Assembly (DFA), and Design for Test (DFT) guidelines. - Generate and release comprehensive documentation packages for fabrication and assembly (Gerbers, ODB++, IPC-2581, drill charts, fabrication drawings). - Work closely with external PCB fabrication and assembly vendors to resolve technical queries (EQs) and continuously improve internal design rules. - Utilize and evaluate advanced PCB design tools, maintaining internal design standards and automation scripts. BASIC QUALIFICATIONS - 3–5+ years of professional experience in complex, high-density PCB layout (or a Bachelor’s degree in Electrical Engineering/related field with 2+ years of experience). - Proficient in high-speed layout techniques (impedance control, differential pairs, length matching, and crosstalk mitigation). - Experience with advanced packaging technologies, including fine-pitch BGAs, high-pin-density components, and microvias (HDI). - Knowledge of PCB materials, dielectric properties, and developing multi-layer board stackups. - Familiarity with layout considerations for EMI/EMC mitigation and robust power delivery networks (PDN). PREFERRED SKILLS AND EXPERIENCE - 5+ years of experience designing high-speed, mixed-signal PCBs for FPGA, processor, or high-performance networking systems. - Deep expertise in routing high-speed interfaces such as multi-gigabit SerDes, DDR memory, JESD204B/C, and 10/100G Ethernet. - Advanced proficiency in industry-standard ECAD tools (Altium Designer, Cadence Allegro, or Siemens Xpedition). - Strong understanding of IPC standards (e.g., IPC