Signal Integrity Lead Engineer

At Kandou , we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption. Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient . Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale. Kandou’s architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future. We are actively seeking a Senior SI/PI Engineer in Hyderabad or Bangalore. Required Experience: 15+ years of experience in the semiconductor industry, with a focus on topics related to signal and power integrity Strong foundation in electromagnetics and system-level design, including material (package, PCB, board, connector, cable), as well as analog, power, and digital electronics Proven leadership of SI/PI, package, and PCB teams delivering multi-Gbps link solutions. Must be able to articulate one or more significant SI problems that were solved with innovative design of connector, package or cable. Hands-on problem solver with the ability to quickly grasp new concepts and translate them into practical solution Curious, fast learner who thrives in tackling unfamiliar challenges and driving them to completion in real-world systems Collaborative team player with strong cross-functional communication skills Responsibility: Lead the SI/PI function at Kandou AI, defining methodologies, best practices, and technical direction Partner with technology and product teams to guide SI/PI architecture and resolve system-level challenges Work closely with circuit designers to ensure robust SI/PI implementation in silicon Engage with customers and suppliers to define and validate hardware solutions (packages, PCB/backplane layouts, materials, interposers, connectors) for Kandou products Perform and lead theoretical and simulation-based SI analysis of products, channels, test structures, and system implementations Prepare and communicate technical analyses and recommendations to internal teams and external stakeholders Evaluate and benchmark signaling schemes (e.g., Chord signaling, PAM) in terms of SI/PI performance, power, and implementation trade-offs Drive SI/PI and power delivery solutions for packages and evaluation platforms in collaboration with design teams Collaborate with system architects to define and extract channel specifications and requirements Skills Deep understanding of SI/PI design and simulation across abstraction levels, from EM modeling to system-level link behavior Expertise with EM/SI/PI tools and modeling flows, including calibration, correlation, and validation. Sufficient familiarity with lab measurements with VNA, spectrum analyzers and high-speed scopes is expected. Strong intuition for EM simulation trade-offs (accuracy, runtime, model complexity) and their impact on design decisions Experience with channel modeling and extraction for multi-Gbps systems, including end-to-end link considerations Proficiency in Linux-based design environments and scripting (MATLAB, Python) for modeling and automation Solid understanding of signaling schemes and link architectures, including their performance, complexity, and power trade-offs Qualifications: Required: Masters of Engineering in Physics Electronics or Electrical Engineering (equivalent or higher) Desired: PhD in electromagnetics related areas such as physics or Electrical or Electronics engineering If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would really love to hear from you. Together We Kandou It! https://www.kandou.ai/