Senior Thermal Engineer

About Corintis: Corintis offers innovative microfluidic cooling technologies for AI chips/GPUs and CPUs used in data centres. Working with many of the world’s largest tech companies, our solutions improve compute sustainability and tackle the excessive electricity consumption associated with data centre cooling, which consumes more electricity than New York and London combined. Ranked as the No.1 Engineering startup in Switzerland for 2025, Corintis offers a friendly and team-oriented workplace, bringing together over 85 people from over 35 nationalities to solve the most significant computing challenges of tomorrow. Based in the EPFL Campus in St. Sulpice, we are closely connected to the local ecosystem and are located a few minutes walk from Lake Geneva. Job Description We are seeking a highly skilled and self-driven Thermal Engineer to contribute to the development and optimization of Corintis’ advanced thermal simulation and cooling technologies. In this role, you will support the design, modeling, and validation of next-generation semiconductor cooling systems, ensuring high-performance thermal management through rigorous multiphysics analysis. Reporting to the engineering leadership team, you will play a key role in executing thermal design strategies, developing and refining simulation models, and translating customer and system requirements into robust, manufacturable solutions. You will collaborate closely with cross-functional teams to enhance cooling performance, validate designs experimentally, and contribute to the continuous improvement of our thermal engineering methodologies. Responsibilities: Design and develop microfluidic cooling devices based on customer specifications. Utilize analytical and numerical modelling to support device design and performance optimization. Create mechanical components and assemblies for seamless integration between our product offerings and the customer requirements. Produce detailed technical drawings and oversee the manufacturing process maintaining high quality standards. Develop and implement specialized test setups to validate the cooling performance and packaging integrity of microfluidic solutions. Conduct experimental validation, including testing and data analysis, to characterize and refine prototype performance, ensuring optimal thermal and mechanical integration. Gather, analyse, and interpret data from experimental tests, using findings to inform and refine designs. Collaborate with customers to tailor solutions to specific HPC and AI platforms. Innovate advanced solutions for the mechanical integration of cooling devices into broader systems. Contribute to fundamental R&D activities within the Hardware team, fostering a collaborative environment. Research emerging technologies and trends in liquid cooling and thermal management. Drive the innovation of energy-efficient and environmentally sustainable cooling solutions. Requirements: M.Sc . in Mechanical Engineering, Microengineering, Materials Science, or a related field; a PhD is a plus. Minimum of 5 years relevant industrial experience in liquid cooling for electronic systems, ranging from R&D, product development, testing to industrialization. Ideally in data center applications. Strong proficiency in mechanical design, tolerancing, and technical drawing for manufacturing. Prior experience in leading a new product from design into volume production. Advanced CAD skills (Solidworks preferred). Extensive hands-on experience designing thermal management solutions for GPUs, CPUs, or custom AI accelerators. Good understanding of advanced packaging (2.5D, 3D integration) and the associated challenges related to thermal management. Knowledge of packaging and mechanical integration of microfluidic systems in commercial HPC or AI platforms. Familiarity with materials science as it relates to thermal management and system reliability for liquid cooling applications. Familiarity with failure mechanisms for liquid cooling in