Staff Mechanical Engineer

Lightmatter is leading the revolution in AI data center infrastructure, enabling the next giant leaps in human progress. The company invented the world’s first 3D-stacked photonics engine, Passage™, capable of connecting thousands to millions of processors at the speed of light in extreme-scale data centers for the most advanced AI and HPC workloads. Lightmatter raised $400 million in its Series D round, reaching a valuation of $4.4 billion. We will continue to accelerate the development of data center photonics and grow every department at Lightmatter! If you're passionate about tackling complex challenges, making an impact, and being an expert in your craft, join our team of brilliant scientists, engineers, and accomplished industry leaders. Lightmatter is (re)inventing the future of computing with light! In this role, you will be working on leading-edge packaging technologies to enable AI architectures that set new industry standards for compute power, performance, and efficiency. As a member of the Packaging Analysis team, you will perform mechanical design and structural analysis for emerging packaging technologies. You will identify key failure modes under product use conditions and run appropriate parametric design studies to influence product and package design upstream. You will be responsible for the package stack-up analysis, defining mechanical and thermal aspects that influence package form factors, and driving socket/enabling mechanisms. You will utilize Finite Element Analysis (FEA) and Geometric Dimensioning and Tolerancing (GD&T) to propose solutions that finalize the design. Your work will result in advanced package designs that meet power dissipation, assembly, and reliability requirements, while delivering a system level solution for leading edge products in the data centers and high-end compute segment. Responsibilities: Create mechanical models of package stack-up and associated components. Perform mechanical design analysis to identify and implement solutions that improve package mechanical integrity. Execute geometric tolerance analysis and create GD&T drawings and CAD models. Conduct finite element analysis to highlight key design, assembly, and reliability trade-offs. Apply manufacturing expertise to influence design choices, perform FMEAs, and evaluate the cost implications of process and design decisions. Collaborate with package and systems teams to ensure packaging solutions comply with system boundary conditions. Generate modeling and simulation reports. Requirements: BS, MS or PhD in Mechanical Engineering or a related field. Minimum of 5 years of experience in mechanical design and finite element analysis. Experience in CAD tools such as Solidworks or AutoCAD, with a focus on mechanical design best practices. Expertise in Geometric Dimensioning and Tolerancing (GD&T) and tolerance stack-up analysis. Hands-on experience with FEA solvers such as ABAQUS or ANSYS. Working knowledge of semiconductor packaging technologies, including the mechanical and thermal trade-offs of 3D, 2.5D, and FCBGA architectures. Preferred Qualifications Knowledge of ASME Y14.5 standards. Excellent communication skills and ability to work well in cross functional teams. Ability to drive results independently and with minimal supervision. Creative problem-solving skills with a focus on rapid solution implementation. We offer competitive compensation. The base salary range for this role determined based on location, experience, educational background, and market data. Salary Range: total compensation goes beyond base salary, it also includes a new hire equity grant, annual performance-based equity, and other rewards that recognize your impact and contribution. $135,000 — $212,000 USD Benefits Comprehensive Health Care Plan (Medical, Dental & Vision) Retirement Savings Matching Program Life Insurance (Basic, Voluntary & AD&D) Generous Time Off (Vacation, Sick & Public Holidays) Paid Family Leave Short Term & Long Term Disabi