Process Engineer, Wafer-Level Packaging (Akoustis)

SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars. PROCESS ENGINEER, WAFER-LEVEL PACKAGING (STARLINK/AKOUSTIS) Akoustis is now operating as a wholly owned subsidiary of SpaceX, providing industry leading RF filters using patented XBAW technology to help drive the mission of making human life multi-planetary and connecting the world through Starlink. We design, build, launch, and operate the world's largest constellation of satellites, enabling us to operate a global internet network unbounded by traditional ground infrastructure limitations. The root of SpaceX’s success so far lies in our mission to keep all engineering and production in-house, which enables a tight feedback loop, nimble decision-making, and speedy deliverables. With millions of daily users worldwide already online, Starlink is truly a game-changer and levels the playing field for those who were previously unconnected. Akoustis supports the success of Starlink by supplying world-class RF filters manufactured with the highest levels of quality and reliability. At Akoustis, we continually strive for manufacturing excellence with a focus on cost controls and production throughput. We are seeking an experienced Wafer Level Packaging (WLP) Process Engineer to join our manufacturing team. RESPONSIBILITIES: Assume primary ownership of processes and equipment associated with the Akoustis WLP (wafer-level packaging) production line Develop and implement new WLP processes and integrate them into the production flow Drive continuous process improvement to existing WLP processes across various products in a high-mix environment to enhance yield, reduce cycle time, and lower manufacturing costs Write and maintain standard operating procedures (SOPs), engineering instructions, and documentation related to WLP process control and specifications Work closely with maintenance teams and tool vendors to troubleshoot and resolve tool and process issues Collaborate with design teams to establish ground rules and designs that optimize manufacturability Lead the installation of new WLP tools, including both capability-enhancing and capacity expansion tools Utilize statistical process control (SPC) and design of experiments (DOE) methodologies to monitor, control, and qualify processes Apply structured problem-solving tools such as 8D, risk management, and change control systems to resolve and prevent recurring issues Create process and metrology recipes on equipment BASIC QUALIFICATIONS: Bachelor's degree in chemical engineering, electrical engineering, materials science or other STEM discipline Experience in semiconductor packaging process engineering PREFERRED QUALIFICATIONS: Proven experience with: EVG automated top side mask aligners TEL clean track systems TTS automatic wafer tape laminators Polyimide coating Metrology tools for alignment, CD, film thickness, and defect analysis Proficiency in JMP statistical software, Microsoft Office Suite, and KLayout CAD software Strong written, verbal, and organizational communication skills Demonstrated ability to create detailed technical documentation and training materials Solid understanding of SPC, DOE, 8D, and risk/change management processes Experience leading cross-functional projects or tool installation programs Familiarity with high-volume manufacturing environments involving frequent product changeovers Experience in participating in quality audits and yield improvement initiatives ADDITIONAL REQUIREMENTS: Work a large percentage of the day in a cleanroom with strict adherence to Class 100 level gowning protocols Work in an environment requiring strict adherence to workplace safety rules, where additional PPE is required in certain circumstances Must be willing to work extended hours and weekends as n