Test Specialist, Silicon Assembly (Starlink)

SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars. TEST SPECIALIST, SILICON ASSEMBLY (STARLINK) One of the most ambitious missions that SpaceX has undertaken to date, the Starlink satellite constellation, is our solution to providing reliable internet to the entire world. In true SpaceX fashion, Starlink is taking the next step in vertical integration by bringing integrated circuit packaging and assembly in-house for development and manufacturing. You will work closely with IC packaging engineers, test engineers, equipment manufacturers and leadership. The success of Starlink depends on the quality, reliability, cost, manufacturability, throughput, and security of the products that you deliver. If you seek a fast-paced, dynamic environment; if you thrive on solving difficult problems where resolutions have high impact; and if you love the challenge of building something from scratch, then this role will be an ideal next career step. RESPONSIBILITIES: Partner with the engineering team on integration & process of record (POR) definition Perform recipe development, automated equipment programming, and validation Perform wafer-level probing and testing using DC/RF probe stations, parametric analyzers, and vector network analyzers (VNAs) to measure I-V characteristics, capacitance, RF insertion loss, and return loss on individual dies Execute package-level RF testing on assembled devices, including high-frequency characterization up to mm Wave bands, utilizing test sockets, handlers, and ATE systems to validate gain, linearity, and power handling Develop and optimize test programs and recipes, scripting in languages like Python or LabVIEW to automate data collection, statistical analysis, and binning for yield optimization Analyze test data for outliers, process excursions, and correlations using SPC tools, generating reports on key metrics such as test time, defect maps, and RF performance distributions Collaborate with design, process, and packaging teams to debug failures, qualify new test hardware, and integrate testing into the full product lifecycle from wafer sort to final package validation Maintain test equipment through calibration, preventive maintenance, and troubleshooting to ensure measurement accuracy and minimize downtime in a high-throughput environment Adhere to cleanroom protocols, ESD safeguards, and safety standards for handling RF components and high-power test signals BASIC QUALIFICATIONS: High school diploma or equivalency certificate 3+ years of professional experience in a hands-on manufacturing environment; OR bachelor's degree in an engineering, math or science discipline PREFERRED SKILLS AND EXPERIENCE: Bachelor's degree in an engineering, math or science discipline 6+ years of experience in wafer probing or RF package testing within a semiconductor manufacturing or test environment Thorough knowledge of electrical theory including digital, analog, and RF circuitry Proficiency with RF test equipment, including VNAs, spectrum analyzers, oscilloscopes, along with the understanding of semiconductor device physics and RF parameters Strong skills in test automation and data analysis software (e.g., Excel, JMP, or Python) for SPC, yield modeling, and failure diagnostics Ability to fabricate and repair cable harnesses including: soldering, crimping, assembling connectors for bench testing, debugging & failure analysis; J-STD-001 certification is a plus Excellent manual dexterity and the ability to perform bench top testing/manual probing under microscope ADDITIONAL REQUIREMENTS: Must be able to work all shifts and be willing to work overtime and/or weekends as needed Standing for long periods of time, climbing up and down ladders, bending, grasping, sitting, pulling, pushing, stooping