Senior NPI Engineering Program Manager I (SMT Process)

Join Axon and be a Force for Good. At Axon, we’re on a mission to Protect Life. We’re explorers, pursuing society’s most critical safety and justice issues with our ecosystem of devices and cloud software. Like our products, we work better together. We connect with candor and care, seeking out diverse perspectives from our customers, communities and each other. Life at Axon is fast-paced, challenging and meaningful. Here, you’ll take ownership and drive real change. Constantly grow as you work hard for a mission that matters at a company where you matter. Your Impact We have an aggressive schedule for development and release of next-generation de-escalation devices. The NPI group is driving changes to ensure that new products can be built at scale with high yield and low cost, and we need highly skilled, motivated, technical people to set expectations and drive results from internal and external factory and design teams. As our dedicated SMT process authority in Southeast Asia, you will close a critical gap in CM oversight, board-level failure analysis, and DFx feedback — ensuring our PCB assemblies are manufacturable, qualified, and ready to scale. What You'll Do Work Location: This role is based out of our Ho Chi Minh Offic e and follows a hybrid schedule. We rely on in-person collaboration and ask that team members work onsite Tuesdays through Fridays, with the flexibility to work remotely on Mondays, unless there is an approved workplace accommodation. We believe that connection fuels innovation, and our in-office culture is designed to foster meaningful teamwork, mentorship, and shared success. Reports to: Director, NPI Engineering Direct Reports: None As a Sr. NPI Engineering Program Manager I, you will own SMT process development, qualification, and continuous improvement for new hardware programs from concept through mass production with Southeast Asia contract manufacturers (CMs). Acting as the primary SMT technical interface between Axon's electrical design engineering teams and factory operations, you will lead DFM/DFA reviews focused on PCB layout and solderability, qualify solder paste, reflow, and selective solder processes, and interpret SPI, AOI, AXI, and ICT data to drive corrective action. You will perform board-level failure analysis, develop PFMEA and control plans, and execute DOEs to optimize process parameters and confirm capability. You will challenge CM root cause analyses, monitor yield trends, and close build readiness actions across process, equipment, materials, and quality at each APL gate. The role requires up to 30% travel to CM sites across Southeast Asia. Success is measured by first-pass SMT yield, build schedule adherence, CM process qualification status, and reduction in board-level escapes across NPI phases. Key Responsibilities Plan and execute contract-manufacturer PCB assembly builds through Axon Product Lifecycle gates (SP, EVT, DVT, PVT) with clear SMT readiness metrics and exit criteria Lead DFM/DFA reviews with electrical design teams, focusing on board layout, component placement, land pattern design, panelization, and solderability Drive solder paste, reflow, wave, and selective solder process qualification at CM sites Specify and validate CM equipment, stencil design, and material selection (paste, flux, PCB surface finish) Interpret and act on SPI, AOI, AXI, and ICT data to identify and resolve process escapes before they impact yield Perform board-level failure analysis: solder joint characterization, cross-sectioning, delamination, pad cratering, and component failure modes Plan and execute DOEs for reflow profile optimization, underfill, conformal coat, and other SMT processes; confirm process capability Monitor yield and process capability with SPC; trigger and drive corrective actions from data trends Challenge CM yield data and root cause analyses; drive to verified fixes rather than accepting first answers Develop and maintain PFMEA, control plans, and process flow docume