Senior Optical Packaging Process Engineer

PsiQuantum’s mission is to build the first useful quantum computers—machines capable of delivering the breakthroughs the field has long promised. Since our founding in 2016, our singular focus has been to build and deploy million-qubit, fault-tolerant quantum systems. Quantum computers harness the laws of quantum mechanics to solve problems that even the most advanced supercomputers or AI systems will never reach. Their impact will span energy, pharmaceuticals, finance, agriculture, transportation, materials, and other foundational industries. Our architecture and approach is based on silicon photonics. By leveraging the advanced semiconductor manufacturing industry—including partners like GlobalFoundries—we use the same high-volume processes that already produce billions of chips for telecom and consumer electronics. Photonics offers natural advantages for scale: photons don’t feel heat, are immune to electromagnetic interference, and integrate with existing cryogenic cooling and standard fiber-optic infrastructure. In 2024, PsiQuantum announced government-funded projects to support the build-out of our first utility-scale quantum computers in Brisbane, Australia, and Chicago, Illinois. These initiatives reflect a growing recognition that quantum computing will be strategically and economically defining—and that now is the time to scale. PsiQuantum also develops the algorithms and software needed to make these systems commercially valuable. Our application, software, and industry teams work directly with leading Fortune 500 companies—including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical—to prepare quantum solutions for real-world impact. Quantum computing is not an extension of classical computing. It represents a fundamental shift—and a path to mastering challenges that cannot be solved any other way. The potential is enormous, and we have a clear path to make it real. Come join us. Job Summary: This role will focus on developing and optimizing high-precision optical packaging processes for photonic modules, with a strong emphasis on active alignment, process development, and NPI (New Product Introduction). The ideal candidate will bring hands-on experience and technical knowledge of optical packaging or process optimization, and product reliability. Responsibilities: Develop, validate, and optimize a ctive alignment processes for high-precision optical components (fiber arrays, etc.). Lead process development and qualification for optical module packaging. Support NPI efforts, including DFM (Design for Manufacturability), DFR (Design for Reliability), and transition to production. Design and execute experiments to characterize and optimize optical coupling efficiency, mechanical tolerances, and thermal performance. Drive root cause analysis of yield/reliability issues and implement robust corrective actions. Develop process documentation (PFMEAs, control plans, work instructions) and train technicians. Collaborate with external vendors and internal stakeholders to select materials, tools, and automation solutions. Participate in equipment selection, installation, and qualification for process scaling. Experience/Qualifications: Master’s Degree or above in Engineering, Physics or Material Science. 10+ years of experience with/at semiconductor company or supplier working on PIC packaging design, qualification & multi-chip assemblies. 5+ years of experience working with optical fibers, optical measurements. 5+ years of work experience with advanced semiconductor packaging OSAT (Outsourced Semiconductor Assembly & Test) and/or EOL vendors. 5+ years of experience with semiconductor company or supplier working on FAU / optical connector to chip attachment. Experience with fiber attach tooling & process/flow development and optical data analysis. Experience with FA and 8D failure resolution techniques. Experience with developing metrics for yield and quality management, including reliability and y